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Package front-side and back-side view. (dimensions in millimeters)
Front-side View
Front-side View details
Cell Size
Back-side View details
Moisture Sensitivity, Reflow Soldering and Washing Information
IXYS has characterized the moisture reflow sensitivity of the SolarMD using IPC/JEDEC standard J-STD-020. Moisture uptake from
atmospheric humidity occurs by diffusion. During the solder reflow process, in which the component is attached to the PCB, the whole
body of the component is exposed to high process temperatures. The combination of moisture uptake and high reflow soldering
temperatures may lead to moisture induced delamination and cracking of the component. To prevent this, this component must be
handled in accordance with IPC/JEDEC standard J-STD-020 per the labeled moisture sensitivity level (MSL), level 1. IXYS does not
recommend the use of chlorinated solvents.
Surface Protection Film
Please be advised that SLMD module is normally covered with protection film by factory to prevent it from scratch or dirt during the
transportation, Therefore it is highly recommended to remove the protection film at the end of your work. Especially when SLMD
should go through the high temperature process or environment, the film should be removed in advance. If protection film is not
wanted, please consult with us.
IXYS reserves the right to change limits, test conditions and dimensions
? 2010 IXYS All rights reserved
IXYS KOREA LTD.
906-5 Iui-dong, Yeongtong-Gu, Suwon, Gyeonggi-Do (Korea)
Phone +82-31-888-5232, Fax +82-31-888-5233
3
Rev. Jan. 2011
IXYS Corporation
1590 Buckeye Drive, Milpitas, CA 95035-7418
Phone (408) 457-9000, Fax 408-496-0670
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相关PDF资料
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